ADLINK Technology Inc., a global leader in edge computing, will be at Embedded World 2023 to showcase its responses to trends in the embedded market. There will be multiple demonstrations on the stand to showcase AI at the edge for autonomous driving, machine vision, robotics, and more. ADLINK will also unveil its latest processor integration for scalable Edge AI platforms. During the event, product managers will be available to talk through the technology, as well as key executives to provide industry insight.
With the strong eco-system partnership supporting, ADLINK has helped customers around the world to build autonomous driving solutions, including autonomous mobile robots (AMRs), robo-taxis, and autonomous trucks and mining vehicles based on the Intel® Sapphire Rapids, Ampere® Altra® and NVIDIA® Jetson Orin™ technologies. Certified to the ISO 26262 automotive functional safety standard, ADLINK has established a development and production process that complies with all safety regulations up to ASIL D.
“Functional safety becomes even more critical with higher levels of autonomous driving,” says Stephen Huang, President & COO, ADLINK. “We apply our ISO 26262 certified development process to our autonomous driving platform and comprehensive customization services to help accelerate innovation.”
Showcasing this capability, there will be a live autonomous driving proof-of-concept (PoC) demonstration, together with our partners Tier IV and Ouster, which meets different autonomous driving applications from levels 1 to 4. The car combines four Tier IV C1 cameras and an Ouster OS1-32 LiDAR sensor with ADLINK’s RQX-590 high-performance ROS2-enabled embedded robotic controller and AVA-3510 AI-enabled autonomous driving system. Showcasing its comprehensive customization services, ADLINK will also demonstrate a fully customized production-grade autonomous driving solution with an integrated liquid cooling system.
Another first at the show will be the unveiling of ADLINK’s powerful, discrete graphics card on the embedded MXM form factor, the MXM-AXe. It integrates the latest Intel® ARC™ A-Series graphics processor for Mobile, code-named Alchemist. Leveraging Intel’s well-established graphics ecosystems, such as OpenVINO™ for AI and Intel® OneAPI (including Intel® MediaSDK) management tools, that edge developers have enjoyed and relied on for years, it makes migration from integrated to discrete graphics seamless and fully transparent.
As experts in the design and manufacture of custom and standard embedded hardware solutions, ADLINK will showcase a selection of its wide range of standard Edge AI platform products and solutions. Featuring the latest technologies from Intel®, NVIDIA® and Arm®, these include next-generation industrial boards and fanless embedded PCs, low power Arm®-based IIoT gateway and industrial-grade multi-display digital signage solutions. In addition, the ADLINK ASD+ industrial-grade high-performance SSD family series will be unveiled.
Visitors to the stand will also see a variety of live demonstrations, including the latest in industrial-grade touchscreen technology featuring 7H hardness, IP65 protection on the front panel, and backlight life of up to 50,000 hours. The open-frame (OM series) and true-flat (IM series) monitors are designed to visualize intelligence at the edge. With responsive touch control, they feature a 10-point multi-touch capability for smooth zoom, flick, rotate, pinch, and other functions. The anti-fingerprint surface treatment on the touchscreen eases cleaning and enhances readability. The in-plane switching (IPS) monitors with wide viewing angles display immersive visuals for better color and contrast, outstanding color accuracy, and screen consistency compared with vertical alignment (VA) and twisted nematic (TN) monitors.
For efficient edge, IoT multitasking with industrial-grade stability, ADLINK introduces its latest COM Express and COM-HPC modules based on Intel® 13th Gen Core™ processors, code-named Raptor Lake.
The Express-RLP COM Express (COM.0 R3.1) Type 6 module offers up to 14 cores, 20 threads, 64GB DDR5 SO-DIMM, PCIe Gen4, and an extremely rugged option at 15/28/45W TDP. The COM-HPC-cRLS Client Type Size C module offers up to 24 cores, 128GB DDR5 SO-DIMM, PCIe Gen5, 2x 2.5GbE LAN, and is also available in an extremely rugged option. Supporting Intel® TCC, and Time Sensitive Networking (TSN), the modules are fitted for hard-real-time computing workloads required by applications such as industrial automation, autonomous driving, AI robots, and aviation.
ADLINK’s all-in-one AI camera development kit makes prototyping and testing of Edge AI vision systems easy and straightforward. All of the hardware and software are provided and pre-installed with a full range of interfaces, including DI/O, COM, and LAN ports, as well as an array of optional accessories. The GUI-based development tool provides a low-code environment with software tools for labeling and training, and two open-source selected models so users can build a PoC without AI expertise.
For state-of-the-art mission-critical products with AI enablement, where failure is not an option and time to deployment is key, ADLINK’s experts will be delighted to share its solutions. ADLINK will showcase its latest industry-standard CompactPCI, CompactPCI Serial, VPX (SOSA-aligned) and PC104 rugged computing solutions that include advanced CPU and GPU technologies, enabling AI at the edge applications in railway, military, industrial automation, and various other vertical markets. This portfolio of COTS blades and systems provides mission-critical applications with reliability, longevity and the latest AI technology.
Visitors to the stand will be able to select from a range of development kits based on all of ADLINK’s latest technologies. To make an appointment, please contact: [email protected]